| GENERAL
SPECIFICATION
The
following are applications which meet most of
our customers’ requirements. It is valid
for most of our customers. If you have any other
particular specification, we welcome your comment.
|
| SOLDER
MASK APPLICATION |
| WET
FILM PROCESS: |
High
density solder mask pattern with min. annular ring
of registration 0.005“. |
| SILK
SCREEN PROCESS: |
General
solder mask pattern with annular ring of registration
0.010“. |
| IMAGE
APPLICATION |
| DRY
FILM PROCESS: |
Two
track per channel with min. line width 0.003“
and space and min. pad annular ring 0.003”. |
| SILK
SCREEN CIRCUIT IMAGE: |
Min.
line width 0.008 and min. pad annular ring 0.005“. |
| DRILLED
HOLE REGISTRATION: |
True
position of X.Y
Coordinate
+/-003“
|
| PATTERN
REGISTRATION: |
Tolerance
with +/-006“ |
| TEST
CAPACITY |
2000~4000
Points |
| CONTINUITY
TEST: (SHORT) |
10~100
OHMS |
| INSULATION
TEST: (OPEN) |
100K
OHMS-5 MEGA OHMS |
| HOLE
REQUIRED SIZE: |
Tolerance
to controlled to +/-003“ |
| PUNCHING
HOLE: |
Tolerance
to controlled to +/-006“ |
| PLATING: |
A
fully automatic plating line provides even and constant
gold plating. |
| PATTERN
PLATING |
| The
boards then go into the fully automatic plating
lines for solder deposition. Computer control of
this process guarantees consistent plating quality
at high-volume production. |
| SOLDER
COATING |
| Automatic
solder coater-leveler applies bright, uniform solder
coating to the PCB, of which thickness, fused solder
is required. |
| BOARD
THICKNESS |
The
total thickness of 2 layers, 4 layers are well controlled
in 0.032-0.062 +/-005“. |
| CIRCUITRY |
Three
lines per channel and 0.004“/0.004 "line
/ space. |
| SURFACE
MOUNT TECHNOLOGY |
| Uneven
thickness of solder levelling surface can be controlled
within 0.003“ no solder mask bleeding, leakage
be found on pattern site. |
| TAB
GOLD FINISHING |
| Apply
double image of dry film in result of high registration
of positioning, gold thickness can be required to
5-30m “. |
| MANUFACTURING
CAPABILITY |
| Number
of new part numbers per week |
25 |
| Number
of samples per week |
30 |
| Available
laminates |
FR-4,
CEM-1, FR-2, FR-1,
XPC |
| Maximum
board size |
24“
x 18” |
| Board
thickness |
FR4
0.25mm ~ 3.20mm
CEM -1 1.00mm ~1.60mm
FR2 0.80mm ~ 1.60mm
FR1 0.80mm ~ 1.60mm
XPC 0.80mm ~ 1.60mm |
Minimum
copper thickness available:
- Surface thickness |
0.5mils
(1/3 oz ) 12.0 um
0.7mils (1/2 oz ) 17.5 um
1.4mils (1 oz ) 35.0 um
2.8mils (2 oz ) 70.0 um
4.2mils (3 oz ) 105.0 um
|
| No.
Of Layers |
FR4
: 1 ~ 8 Layers (0.3~3.2mm)
CEM -1 : 1 ~ 2 Layers (1.0 ~ 1.6mm)
FR2 : 1 ~2 Layers (0.8 ~ 1.6mm)
FR1 : 1~2 Layers (0.80 ~ 1.6mm)
XPC : 1 ~ 2 Layers (0.8 ~ 1.6mm)
|
| DRILLING |
| Minimum
Hole Size |
PTH
: 0.20mm
NPTH : 0.30mm |
| Hole
Size Tolerance |
PTH
: +/- 0.076mm
NPTH : +/- 0.051mm |
| Hole
Registration Tolerance |
Coordinate
of X . Y : +/- 0.076mm (First Drill)
+/- 0.127mm (Second Drill) |
| Minimum
Slot Size |
Min.
slot width is 0.70mm
Slot length not less than 2 times of it is width |
| -
PTH thickness |
0.8
- 1.0 mils (avg.) |
| Minimum
hole size ( finishing ) |
0.20mm
( PTH ) |
| Flatness
(warp/twist) capability (min.) |
10
mils / inch |
Surface
finish:
- Fine pitch
- Reflowed tin / lead (min) |
0.010“
~ 0.025”
surface : 300 microinch
(measured a crest)
hole : 500 microinch |
| Hot
air levelling (min) |
surface
:300 microinch
hole :500 microinch |
Soft
gold
( Gold flash over nickel ) |
max.
1 microinch |
| Immersion
Tin |
3
~ 50 microinch |
| Immersion
Silver |
3
~ 50 microinch |
| Immersion
Gold |
Nickel
: 100 ~ 300 microinch
Gold : 1 ~ 3 microinch
|
| ENTEK |
carbon
through hole
copper protective coating |
| Tab
gold plating (norminal) |
15
~ 30 microinch |
| Conductive
ink |
Carbon
epoxy |
| Routing
capacity |
SIZE
: 24“ x 18”
THICKNESS : 0.062“ |
| Punching
capacity |
40-120
tons press
SIZE : 18“ x 18” (MAX)
THICKNESS : 0.062“ |
| Score
(V-cut) Depth |
0.020“
?/small>0.005”
30°OR 45?/- 5?/font> |
